in Japanese

1. Tensile Strength and Pseudo-elasticity of YAG Laser Spot Melted Ti-Ni Shape Memory Alloy Wires
   Yasuhito Ogata, Masaya Takatsugu, Takeshi Kunimasa, Keisuke Uenishi and Kojiro F. Kobayashi
   Materials Transactions, Vol.45 No.4 (2004) in press
   
   
2. BGA Joint Microstructure of Sn-Ag Based Solders with Au/Ni-P Plating
   Keisuke Uenishi, Shigeaki Sakatani, Takashi Yamamoto and Kojiro F. Kobayashi
   Transactions of the Materials Research Society of Japan, (2004) in press
   
   
3. Effect of Ag Addition on Formation of Intermetallic Compound Al3Ti by Combustion Synthesis
   Yoji Miyazaki, Keisuke Uenishi and Kojiro F. Kobayashi
   Materials Science Forum, (2004) in press
   
   
4. Dissimilar Joining of Nickel Aluminide Intermetallic Compound with Spheroidal Graphite Cast Iron by Using Combustion Synthesis
   Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
   Science and Technology of Advanced Materials, (2004) in press
   
   
5. Dissimilar Joining of Nickel Aluminide Intermetallic Compound with Spheroidal Graphite Cast Iron and Cu Alloy by hot pressing
   Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
   Materials Science Forum, (2004) in press
   
   
6. Effect of Platings on Cu Surface on Reliability of Micro Joints Using Sn-Ag Based Lead Free Solders
   Keisuke Uenishi, Akio Hirose and Kojiro F. Kobayashi
   Journal of Japan Resaerch Institute for Advanced Copper-Base Materials and Technologies, Vol.43 (2004) in press (Japanese)
   
   
7. Enhanced Densification of Combustion Synthesized Ni-Al Intermetallic Compound by Si Addition
   Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
   Intermetallics, Vol.11 Iss.6 (2003) p.947-952
   
   
8. Solderability of BGA Joints between Cu Core Solder Balls with Sn/Ag Multi Plating and Ni/Au Coated Pads
   Shigeaki Sakatani, Toshio Saeki, Yasuhiro Kohara, Keisuke Uenishi. Kojiro F.Kobayashi and Masaharu Yamamoto
   Journal of Japan Institute of Electronics Packaging, Vol.6 No.6 (2003) p.509-515 (Japanese)
   
   
9. Enhanced Densification of Combustion Synthesized Ni-Al and Ti-Al Intermetallic Compounds by Third Element Addition
   Keisuke Uenishi, Tetsuro Kimata, Yoji Miyazaki and Kojiro F. Kobayashi
   Materials Science Forum, Vol.426-432 (2003) p.1789-1794
   
   
10. Effect of Ag Addition on Formation of Intermetallic Compounds Al3Ti by Combustion Synthesis
    Yoji Miyazaki, Keisuke Uenishi and Kojiro F. Kobayashi
    Journal of Japan Institute of Metals , Vol.67 No.5 (2003) p.302-307 (Japanese)
    
    
11. Formation of Thick Ni-Al Composite Coating on Spheroidal Graphite Cast Iron Substrates by Reaction Synthesis Processing
    Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
    Materials Transactions, Vol.44 No.3 (2003) p.407-410.
    
    
12. Sintering Process of PB(Zr,Ti)O3 Ceramics and Dielectrical Properties
    Tomoaki Goto, Keisuke Uenishi, Kozo Fujimoto and Kojiro F. Kobayashi
    Journal of High Temperature Processing, Vol.29 No.2 (2003) p.51-57. (Japanese)
    
    
13. Microstructure and Tensile Strength of Stainless Steel Wires Micro Melted by YAG Laser
    Keisuke Uenishi, Masaya Takatugu, Masanori Seki, Takeshi Kunimasa, Kojiro F. Kobayashi, Takeshi Ikeda and Akihiko Tuboi
    MaterialsTransactions, Vol.43 No.12 (2002) p.3083-3087
    
    
14. Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
    Keisuke Uenishi, Yasuhiro Kohara, Shigeaki Sakatani, Kojiro F. Kobayashi and Masaharu Yamamoto
    Materials Transactions, Vol.43 No.8 (2002) p.1833-1839
    
    
15. Mechanical Strength and Microstructure of BGA joints using Lead Free Solders
    Masataka Nishiura, Akihiko Nakayama, Shigeaki Sakatani, Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi and Kojiro F. Kobayashi
    Materials Transactions, Vol.43 No.8 (2002) p.1802-1807
    
    
16. Wear and Oxidation Resistance of Al2O3 Particle Dispersed Al3Ti Composite with a Nanostructure Prepared by Pulsed Electric Current Sintering of Mechanically Alloyed Powders
    Keisuke Uenishi, Toshio Matsubara, Tomohide Shibutani and Kojiro F.Kobayashi
    Intermetallics, Vol.10 Iss.1 (2002) p.105-111
    
    
17. Fabrication of TiB2 Reinforced Al3Ti Composite Layer on Ti Substrate by Reactive-Pulsed Electric Current Sintering
    Toshio Matsubara, Tomohide Shibutani, Keisuke Uenishi and Kojiro F.Kobayashi
    Materials Science and Engineering A, Vol.A329-331 (2002) p.84-91
    
    
18. Interaction of Solder Balls Containing Cu with Au/Ni Plated Cu Pads
    Keisuke Uenishi, Yasuhiro Kohara, Shigeaki Sakatani and Kojiro F.Kobayashi
    Journal of Japan Resaerch Institute for Advanced Copper-Base Materials and Technologies、Vol.41 No.1 (2002) p.305-309
    
    
19. Nanostructured Titanium-Aluminides and Their Composites Formed by Combustion Synthesis of Mechanically Alloyed Powders
    Keisuke Uenishi, Toshio Matsubara, Makoto Kambara and Kojiro F.Kobayashi
    Scripta Materialia, Vol.44 Iss.8-9 (2001) p.2093-2097
    
    
20. Rapid Solidification of Ti-25mol%Al Alloys by Plasma Spraying
    Keisuke Uenishi, Minoru Murase and Kojiro F.Kobayashi
    Materials Transactions, Vol.42 No.2 (2001) p.269-274.
    
    
21. Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au / Ni Coated Cu Pads
    Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Kojiro F.Kobayashi, Ikuo Shoji, Masataka Nishiura and Masaharu Yamamoto
    Materials Transactions, Vol.42 No.5 (2001) p.756-760
    
    
22. The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3.5Ag Solder
    Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi, Kojiro F.Kobayashi, Ikuo Shoji and Masaharu Yamamoto
    Journal of Japan Institute of Electronics Packaging, Vol.4 No.3 (2001) p.192-199 (Japanese)
    
    
23. Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint Using Electroless Plated Au/Ni Pad
    Toshio Saeki,Yasuhiro Kohara, Keisuke Uenishi, Kojiro F.Kobayashi, Ikuo Shoji and Masaharu Yamamoto
    Journal of Japan Institute of Electronics Packaging, Vol.4 No.4 (2001) p.306-311 (Japanese)
    
    
24. Dissimilar Joining of Ti-Ni Shape Memory Alloy with Pure Ti
    Takeshi Kunimasa, Masanori Seki, Hiroki Yamamoto, Makoto Nojiri, Keisuke Uenishi and Kojiro F.Kobayashi
    Journal of Society of Materials Science, Vol.50 No.11 (2001), p.1218-1222 (Japanese)
    
    
25. Spiral Defect Formation in Friction Welded Aluminum
    Keisuke Uenishi, Yang Zhai, Tom H.North and Gabor J. Bendszak
    Welding Journal, Vol.79, No.7 (2000) p.184s-193s.
    
    
26. Fabrication of Thick Intermetallic Compound Al3Ti Layer on Ti Substrate by Reactive - Pulsed Electric Current Sintering
    Toshio Matsubara, Tomohide Shibutani, Keisuke Uenishi and Kojiro F. Kobayashi
    Intermetallics, Vol.8 Iss.7 (2000) p815-822.
    
    
27. Brazing of Ti-Ni Shape Memory Alloy with Stainless Steel
    Masanori Seki, Hiroki Yamamoto, Keisuke Uenishi and Kojiro F.Kobayashi
    Journal of Japan Institute of Metals , Vol.64 No.8 (2000), p. 632-640. (Japanese)
    
    
28. Fabrication of Thick Intermetallic Compound Al3Ti Layer on Metal Substrate by Combustion Synthesis of Ball-milled Powder
    Toshio Matsubara, Keisuke Uenishi and Kojiro F. Kobayashi
    Material Transactions, JIM, Vol.41 No.5 (2000), p.631-634
    
    
29. Nano-structured Intermetallic Compound TiAl Obtained by Crystallization of Mechanically Alloyed Amorphous TiAl and Its Subsequent Grain Growth
    Makoto Kambara, Keisuke Uenishi and Kojiro F.Kobayashi
    Journal of Materials Science, Vol.35 No.11 (2000), P.2897-2905
    
    
30. Effect of Cu Core to the Micorsture and Mechanical Properties of BGA Joints
    Shinya Kiyono, Keisuke UENISHI, Kojiro F. Kobayashi, Ikuo Shoji, Masaharu Yamamoto
    Journal of Japan Institute of Electronics Packaging, Vol.2 No.4 (1999), (Japanese) p.298-302
    
    
31. Application of Mechanically Alloyed Ti-Al Powders to the Low Pressure Plasma Spraying
    Keisuke Uenishi, Minoru Murase and Kojiro F.Kobayashi
    Z.Metallkunde Bd.90 H.4 (1999), p.289-293
    
    
32. Combustion Synthesis of Intermetallic Compound Al3Ti and Its Simultaneous Joining with TiAl
    Keisuke Uenishi, Toshio Matsubara and Kojiro F.Kobayashi
    Z.Metallkunde Bd.90 H.2 (1999), p.163-167
    
    
33. Formation of Surface Layer Based on Al3Ti on Aluminum by Laser Cladding and Its Compatibilities with Ceramics
    Keisuke Uenishi and Kojiro F.Kobayashi
    Intermetallics, (1999) Vol.7 No.5 (1999) p. 553-559
    
    
34. Fabrication of Al3Ti Layer on Cu Substrate by SHS of Mechanically Alloyed Powder
    Toshio Matsubara, Shinya Morino, Keisuke Uenishi and Kojiro F.Kobayashi
    Journal of Society of Materials Science、Vol.47, No.11 (1998) p.1106-1111 (Japanese)
    
    
35. Mechanical alloying in the Al-Bi System
    Keisuke Uenishi, Kim H.Yong and Kojiro F.Kobayashi
    Journal of Materials Science, Vol.31, (1996), p.3605-3611
    
    
36. Processing of Intermetallic Compounds for the Structural Application at High Temperature Environments
    Keisuke Uenishi and Kojiro F.Kobayashi
    Intermetallics, Vol.4 No.1 (1996) p.S95-101
    
    
37. Intermetallic Compound Al3Ti Based Composite Layers formed on Aluminum Substrate
    Keisuke Uenishi and Kojiro F.Kobayashi
    Solidification Science and Processing, (1996) p.231-238
    
    
38. Formation of Ni-Al Intermetallic Compound Coating on Fe Substrate by Combustion Sunthesis
    Akira Ikenaga, Yoshiyuki Gotoh, Yasuhiro Nitta, Shin Kawamoto, Kojiro F.Kobayashi and Keisuke Uenishi
    Journal of Casting Vol.68,NO.5, (1996)p.417-422 (Japanese)
    
    
39. Joining of Intermetallic Compound TiAl Using Self-Propagating High Temperature Synthesis Reaction
    Keisuke Uenishi, Hiroyuki Sumi and Kojiro F.Kobayashi
    Zeitschrift fur Metallkunde., B86, H.1, (1995) p.64-68.
    
    
40. Joining of Intermetallic Compound TiAl by Using Al Filler Metal
    Keisuke Uenishi, Hiroyuki Sumi and Kojiro F.Kobayashi
    Zeitschrift fur Metallkunde., B.86, H.4, (1995) p.270-274
    
    
41. Enhanced Milling Efficiency for Amorphization by Mechanical Alloying the Mixture of pure Al and Atomized Al-20at%Cr Alloy Powders
    Keisuke Uenishi and Kojiro F.Kobayashi
    Materials Transaction of Japan Institute of Metals, Vol.36, No.7 (1995) p.810-814
    
    
42. Microstructure of Mechanically Alloyed Al-In Alloys
    Keisuke Uenishi, Hidemi Kawaguchi and Kojiro F.Kobayashi
    Journal of Materials Science, Vol.29 (1994) p.4860-4865.
    
    
43. Fabrication of Bulk Amorphous by Rolling of Mechanically Alloyed Al-Cr Powders
    Keisuke Uenishi and Kojiro F.Kobayashi
    Materials Science and Engineering, A181/182, (1994) p.1165-1168.
    
    
44. Laser Cladding of Intermetallic Compound Al3Ti on Al Substrate
    Keisuke Uenishi and Kojiro F.Kobayashi
    Journal of Light Metal Welding & Constuction,Vol.31 No.4, (1993) p.1-5 (Japanese).
    
    
45. Mechanical Alloying in the Fe-Cu System
    Keisue Uenishi, Kojiro F.Kobayashi, Saburo Nasu, Hitoshi Hatano, Keiichi N.Ishihara and P.Hideo Shingu
    Zeitschrift fur Metallkunde, Bd.83 H.2, (1992), p.132.
    
    
46. Formation of Titanium Aluminides on Aluminium Surface by CO2 Laser Alloying
    Keisuke Uenishi, Akiyoshi Sugimoto and Kojiro F.Kobayashi
    Zeitschrift Fur Metallkunde, Bd.83 H.4, (1992), p.241.
    
    
47. Formation of (Al,In)-Sb Alloys by Mechanical Alloying
    Keisuke Uenishi, Kojiro F.Kobayashi, Keiichi N.Ishihara and P.Hideo Shingu
    Materials Science Forum, Vol.88-90, (1992), p.453.
    
    
48. Non-equilibrium Phase Formation in Fe-Ag-Cu Sysytem by Mechanical Alloying
    Keisuke Uenishi, Kojiro F.Kobayashi, Keiichi N.Ishihara and P.Hideo Shingu
    Materials Science Forum, Vol.88-90, (1992), p.459
    
    
49. Formation of Super-saturated Solid Solution in Ag-Cu System by Mechanical Alloying
    Keisuke Uenishi, Kojiro F.Kobayashi, Keiichi N.Ishihara and P.Hideo Shingu
    Materials Science and Engineering, Vol.A134, (1991), p.1342.

【Proceedings Paper】

1. Pseudo-elastic and Bio-chemical Properties of Ti-Ni Shape Memory Alloy Wires Micro-welded by YAG Laser
   Keisuke Uenishi, Masaya Takatsugu and Kojiro F.Kobayashi
   Proceedings of Fourth International Symposium on Laser Precision Microfabrication, 2003 Munich Germany, SPIE Vol.5063 (2004) p.282-286.
   
   
2. Evaluation of Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Increase the Melting Temperature of Micro Joints
   Takashi Yamamoto, Shigeaki Sakatani, Keisuke Uenishi, Kojiro F. Kobayashi, Masaaki Ishio, Kazuhiro Shiomi, Akio Hashimoto anda Masaharu Yamamoto
   Proc. 9th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, Yokohama Japan, (2004) p.117-122. (Japanese)
   
   
3. YAG Laser Micro Welding of Stainless Steel and Shape Memory Alloys
   Keisuke Uenishi, Masanori Seki, Takeshi Kunimasa, Masaya Takatsugu, Kojiro F.Kobayashi, Takeshi Ikeda and Akihiko Tuboi
   Proceedings of Third International Symposium on Laser Precision Microfabrication, 2002 Osaka Japan, SPIE Vol.4830 (2003) p.57-62
   
   
4. Interfacial Reaction and Joint strength between Sn-Ag Based Solders and Electroles Plated Ni-P Alloys
   Keisuke Uenishi, Yasuhiro Kohara, Shigeaki Sakatani and Kojiro F. Kobayashi
   Proc. 8th Sympo. on Microjoining and Assembly Technologies for Electronics, 2003, Yokohama Japan, (2003) p.289-294. (Japanese)
   
   
5. Joint Microstructure of Ni-Al-(Si) Intermetallic Compound and Spheroidal Graphite Cast Iron Formed by Combustion Synthesis
   Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
   Proc of the Inter. Conf. on Designing of Interfacial Structure in Advanced Materials and Their Joints (DIS'02)、Nov.21-22 2002、Osaka, (2002), p.584-589
   
   
6. Interfacial Reaction Between Cu Core Pb Free Solder Balls and the Ni/Au Coated Cu Pads
   Shigeaki Sakatani, Yasuhiro Kohara, Keisuke Uenishi, Kojiro F. Kobayashi and Masaharu Yamamoto
   Proc of the Inter. Conf. on Designing of Interfacial Structure in Advanced Materials and Their Joints (DIS'02)、Nov.21-22 2002、Osaka, (2002), p.734-739
   
   
7. Nd-YAG Lase Micro Welding of Stainless Wire
   Masaya Takatugu, Masanori Seki, Takeshi Kunimasa, Keisuke Uenishi, Kojiro F. Kobayashi, Takeshi Ikeda and Akihiko Tuboi
   Proc of the Inter. Welding and Joining Conf.-Korea 2002, Oct.28-30, Gyeongju Korea, (2002), p.187-192.
   
   
8. Development of Sn Based Multi Component Solder Balls with Cu Core for BGA Package
   Shigeaki Sakatani, Yasuhiro Kohara, Keisuke Uenishi, Kojiro F. Kobayashi and Masaharu Yamamoto
   Proc of the Inter. Welding and Joining Conf.-Korea 2002, Oct.28-30, Gyeongju Korea, (2002), p.450-455
   
   
9. Effect of added Si on densification of Ni-Al intermetallic coating on spheroidal graphite cast iron substrates
   Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
   Proc of the Inter. Welding and Joining Conf.-Korea 2002, Oct.28-30, Gyeongju Korea, (2002), p.726-731.
   
   
10. Reflow Properties of Sn-Bi/Sn-Ag Coated Cu Core Solder Balls
    Shigeaki Sakatani, Yasuhiro Kohara, Keisuke Uenishi, Kojiro F. Kobayashi, Masaharu Yamamoto
    Proc. 8th Sympo. on Microjoining and Assembly Technologies for Electronics, 2002, Yokohama Japan, (2002) p.147-152. (Japanese)
    
    
11. Microstructure and Reliabilty of BGA Joint Using Lead Free Solders
    Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Masataka Nishiura and Kojiro F.Kobayashi
    Proc. Fourth Pacific Rim Int. Conf. on Advanced Materials and Processing (PRICM4), (The Japan Institute of Metals, 2001) p.1063-1066.
    
    
12. Influence of Microstructure on Mechanical Strength of Electroless ni-P Plating and Pb Free Solder Joint
    Masataka Nishiura, Akihiko Nakayama, Shigeaki Sakatani, Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi and Kojiro F. Kobayashi
    Proceeding of 7th International Conference on Today and Tommorow in Science and Technology of Welding and Joining (7WS)、Nov.20-22　2001、Kobe Japan、Vol.2, p.1305-1310
    
    
13. Formation of Nanostructured Coating Layers of Al3Ti and Its Composites by Rapidly Consolidation of Mechanically Alloyed Powders
    Toshio Matsubara, Tomohide Shibutani, Keisuke Uenishi and Kojiro F.Kobayashi,
    Proc. International Conference on Trends in Mechanical Alloying : Science, Technology & Applications (TMA-2001), Jaipur, India, February 21-23, (2001)
    
    
14. Application of Sn and Ag Multi Plated Cu Core Pb Free Solder Ball to BGA Package
    Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi. Kojiro F.Kobayashi and Masaharu Yamamoto
    Proc. 6th Sympo. on Microjoining and Assembly Technologies for Electronics, 2000, Yokohama Japan, (2001) p.119-124. (Japanese)
    
    
15. Effect of Cu Core on BGA Microstructure using Sn-Ag
    Toshio Saeki, Keisuke Uenishi. Kojiro F.Kobayashi, Ikuo Shoji and Masaharu Yamamoto
    Proc. 6th Sympo. on Microjoining and Assembly Technologies for Electronics, 2000, Yokohama Japan, (2000) p.255-260 . (Japanese)
    
    
16. Microstructure and Mechanical Properties of BGA Joint using Cu Cored Solder Ball-The 2nd Report-
    Shinya Kiyono, Toshio Saeki, Keisuke Uenishi. Kojiro F.Kobayashi, Ikuo Shoji and Masaharu Yamamoto
    Proc. 6th Sympo. on Microjoining and Assembly Technologies for Electronics, 2000, Yokohama Japan, (2000) p.125-130. (Japanese)
    
    
17. Microstructure and Mechanical Properties of BGA Joint using Cu Cored Solder Ball
    Shinya Kiyono, Keisuke Uenishi. Kojiro F.Kobayashi, Ikuo Shoji and Masaharu Yamamoto
    Proc. 5th Sympo. on Microjoining and Assembly Technologies for Electronics, 1999, Yokohama Japan, (1999) p.115-120. (Japanese)
    
    
18. Improvement in Wear Properties of Al by Laser Claddiong of Al3Ti/ceramics Composite Layers
    Keisuke Uenishi and Kojiro F.Kobayashi
    Proc. 4th Int. Conf. on Aluminum Alloys, 1994, Atlanta USA, vol.2 (1994) p.714-720.
    
    
19. Bonding of YBa2Cu3O7-X High Temperature Superconductive Tape on Metal Substrate with Sprayed PSZ Buffer Layer
    Kenichi Matsui, Ryozo Katsutani, Minoru Tagami, Yasumasa Nakanishi, Keisuke Uenishi and Kojiro F.Kobayashi
    Proc. Int. Sympo. on Superconductivity 93', 1993, Hiroshima Japan, (1994) p.839-842.
    
    
20. Application of CIP Treatment of YBa2Cu3O7-X Superconductive Thick Film on Metal Substrate with PSZ Buffer Layer
    Kenichi Matsui, Ryozo Katsutani, Minoru Tagami, Yasumasa Nakanishi, Keisuke Uenishi and Kojiro F.Kobayshi
    Proc. Int. Sympo. on Superconductivity '92, 1992, Kobe Japan, (1993) P.653-656.
    
    
21. Mechanical Alloying of Aluminum Alloys
    Kojiro F.Kobayshi and Keisuke Uenishi
    Proc. 1st Int. Conf. on Proc. Materials for Properties, 1993, Honolulu USA, (1993)p.683.
    
    
22. Laser Cladding of Al3Ti-Ceramics Composite Layer for Al Surface Modification
    Keisuke Uenishi and Kojiro F.Kobayshi
    Proc. of 3rd Japan SAMPE Symposium, 1993, Makuhari Japan, vol.1, (1993) p.1038-1042..
    
    
23. Formation of Titanium-Trialuminide Layer on Aluminum Surface by CO2 Laser Processing
    Keisuke Uenishi, Tomihiro Murakami, Akiyoshi Sugimoto and Kojiro F.Kobayashi
    Proc. Int. Conf. on LAMP, 1992, Nagaoka Japan,Vol.1, (1992), p.807-812.
    
    
24. Metastable Alloy Phase Formation by Repeated Rolling in Some CommonMetallic Binary Alloy Systems
    P.Hideo Shingu, Keiichi N.Ishihara, Keisuke Uenishi, Junji Kuyama, Bing Huang and Saburo Nasu
    Solid State Powder Processing, (1990) p.21-34.
    
    
25. Formation and Consolidation of Mechanically Alloyed Cu-Ti Amorphous Powders
    P.Hideo Shingu and Keisuke Uenishi
    Proc. Sintering '87, 1987, Tokyo Japan, (1988) p.206-211.
    
    
26. Formation of Al-In-Sb Alloys by Solid State Reaction
    P.Hideo Shingu and Keisuke Uenishi
    Proc. Sixth Record of Alloy Semiconductor Physics and Electronics Symposium, 1987, Kyoto Japan, (1988) p.19-25.