Keisuke's List of Papers

論文リスト

in English.


【投　稿　論　文】
  1. Reactivity between Sn-Ag Solder and Au/Ni-Co Plating to Form Intermetallic Phases
    Takashi Yamamoto, Shigeaki Sakatani, Shinji Kobayashi, Keisuke Uenishi, Kojiro F. Kobayashi, Masaaki Ishio, Kazuhiro Shiomi, Akio Hashimoto and Masaharu Yamamoto
    Materials Transaction, Vol.46 No.11 (2005) p.2406-2412
  2. Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings
    Keisuke Uenishi and Kojiro F.Kobayashi
    Materials Science Forum, Vol.502 (2005) p411-416.

  3. Laser Cladding of Fe-Cr-C Alloys on A5052 Aluminium Alloy Using Diode Laser
    Shingo Iwatani, Yasuhito Ogata, Keisuke Uenishi, Kojiro F. Kobayashi and Akihiko Tsuboi
    Materials Transactions, Vol.46 No.6 (2005) p.1341-1347
  4. Dielectric Properties of Pb(Zr,Ti)O3 Ceramics Prepared by Pulsed Electric Current Sintering
    Keisuke Uenishi, Tomoaki Goto, Kozo Fujimoto and Kojiro F. Kobayashi
    Novel Materials Processing, (2005) p.325-328
  5. Tensile Strength and Pseudo-elasticity of YAG Laser Spot Melted Ti-Ni Shape Memory Alloy Wires
    Yasuhito Ogata, Masaya Takatsugu, Takeshi Kunimasa, Keisuke Uenishi and Kojiro F. Kobayashi
    Materials Transactions, Vol.45 No.4 (2004) p.1070-1076

  6. BGA Joint Microstructure of Sn-Ag Based Solders with Au/Ni-P Plating
    Keisuke Uenishi, Shigeaki Sakatani, Takashi Yamamoto and Kojiro F. Kobayashi
    Transactions of the Materials Research Society of Japan, Vol.29 No.5 (2004) p.1995-1999

  7. Dissimilar Joining of Nickel Aluminide Intermetallic Compound with Spheroidal Graphite Cast Iron by Using Combustion Synthesis
    Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
    Materials Science Forum, Vols.449-452 (2004) p.193-196

  8. Combustion Synthesis Process of Ag Added Al3Ti Intermetallic Compound
    Yoji Miyazaki, Keisuke Uenishi and Kojiro F. Kobayashi
    Materials Science Forum, Vols.449-452 (2004) p.201-204
  9. Dissimilar Joining of Nickel Aluminide Intermetallic Compound with Spheroidal Graphite Cast Iron and Cu Alloy by hot pressing
    Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
    Science and Technology of Advanced Materials, Vol.5 (2004) p.251-254
  10. 燃焼合成法によるNi-Al-Si系金属間化合物の作製とそのコーティングへの応用
    木股哲郎、小林紘二郎、上西啓介、池永明、川本信
    鋳造工学 Vol.76 No.9 (2004) p.767-772
  11. Sn-Ag系鉛フリーはんだ接合部信頼性に及ぼす銅表面めっきの影響
    上西啓介、廣瀬明夫、小林紘二郎
    銅と銅合金　Vol.43 No.1　(2004) p.251-256
  12. Enhanced Densification of Combustion Synthesized Ni-Al Intermetallic Compound by Si Addition
    Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
    Intermetallics, Vol.11 Iss.6 (2003) p.947-952
  13. Sn/Ag多層めっきCuコアはんだボールとNi/AuめっきパッドとのBGA接合性評価
    酒谷茂昭、佐伯敏男、小原泰浩、上西啓介、小林紘二郎、山本雅春
    エレクトロニクス実装学会誌、Vol.6 No.6 (2003) p.509-515
  14. Enhanced Densification of Combustion Synthesized Ni-Al and Ti-Al Intermetallic Compounds by Third Element Addition
    Keisuke Uenishi, Tetsuro Kimata, Yoji Miyazaki and Kojiro F. Kobayashi
    Materials Science Forum, Vol.426-432 (2003) p.1789-1794
  15. 燃焼合成法によるAl3Ti金属間化合物相形成に及ぼすAg添加の影響
    宮崎洋二、上西啓介、小林紘二郎
    日本金属学会誌、Vol.67 No.6 (2003) p.302-307

  16. Formation of Thick Ni-Al Composite Coating on Spheroidal Graphite Cast Iron Substrates by Reaction Synthesis Processing
    Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
    Materials Transactions, Vol.44 No.3 (2003) p.407-410.

  17. チタン酸ジルコン酸鉛厚膜セラミックス焼成プロセスとその圧電特性術
    後藤友彰、上西啓介、藤本公三、小林紘二郎
    高温学会誌、Vol.29 No.2 (2003) p.51-57
  18. Microstructure and Tensile Strength of Stainless Steel Wires Micro Melted by YAG Laser
    Keisuke Uenishi, Masaya Takatugu, Masanori Seki, Takeshi Kunimasa, Kojiro F. Kobayashi, Takeshi Ikeda and Akihiko Tuboi
    MaterialsTransactions, Vol.43 No.12 (2002) p.3083-3087
  19. Melting and Joining Behavior of Sn/Ag and Sn-Ag/Sn-Bi Plating on Cu Core Ball
    Keisuke Uenishi, Yasuhiro Kohara, Shigeaki Sakatani, Kojiro F. Kobayashi and Masaharu Yamamoto
    Materials Transactions, Vol.43 No.8 (2002) p.1833-1839

  20. Mechanical Strength and Microstructure of BGA joints using Lead Free Solders
    Masataka Nishiura, Akihiko Nakayama, Shigeaki Sakatani, Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi and Kojiro F. Kobayashi
    Materials Transactions, Vol.43 No.8 (2002) p.1802-1807
  21. Wear and Oxidation Resistance of Al2O3 Particle Dispersed Al3Ti Composite with a Nanostructure Prepared by Pulsed Electric Current Sintering of Mechanically Alloyed Powders
    Keisuke Uenishi, Toshio Matsubara, Tomohide Shibutani and Kojiro F.Kobayashi
    Intermetallics, Vol.10 Iss.1 (2002) p.105-111

  22. Fabrication of TiB2 Reinforced Al3Ti Composite Layer on Ti Substrate by Reactive-Pulsed Electric Current Sintering
    Toshio Matsubara, Tomohide Shibutani, Keisuke Uenishi and Kojiro F.Kobayashi
    Materials Science and Engineering A, Vol.A329-331     (2002) p.84-91

  23. Cuを含有するはんだとAu/NiめっきCuパッドとの界面反応
    上西啓介、酒谷茂昭、小原泰浩、小林紘二郎
    銅及び銅合金技術研究会誌、Vol.41 No.1 (2002) P.305-309
  24. Nanostructured Titanium-Aluminides and Their Composites Formed by Combustion Synthesis of Mechanically Alloyed Powders
    Keisuke Uenishi, Toshio Matsubara, Makoto Kambara and Kojiro F.Kobayashi
    Scripta Materialia, Vol.44 Iss.8-9 (2001) p.2093-2097

  25. Rapid Solidification of Ti-25mol%Al Alloys by Plasma Spraying
    Keisuke Uenishi, Minoru Murase and Kojiro F.Kobayashi
    Materials Transactions, Vol.42 No.2 (2001) p.269-274
  26. Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au / Ni Coated Cu Pads
    Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Kojiro F.Kobayashi, Ikuo Shoji, Masataka Nishiura and Masaharu Yamamoto
    Materials Transactions, Vol.42 No.5 (2001) p.756-760
  27. 無電解Ni/Auめっきパッドを用いたBGA接合部組織に及ぼすはんだボール中のCuコアの影響
    佐伯敏男、清野伸弥、上西啓介、小林紘二郎、荘司郁夫、山本雅春
    エレクトロニクス実装学会誌, Vol.4 No.4 (2001) p.306-311
  28. CuコアSn-3.5Agはんだを用いたBGA接合部組織とせん断強度
    小原泰浩、佐伯敏男、上西啓介、小林紘二郎、荘司郁夫、山本雅春
    エレクトロニクス実装学会誌, Vol.4 No.3 (2001) p.192-199
  29. Ti-Ni系形状記憶合金と純Tiの異材接合
    国政武史、関政則、山本弘樹、野尻誠、上西啓介、小林紘二郎
    材料、 Vol.50 No.11 (2001)、 p.1218-1222
  30. Spiral Defect Formation in Friction Welded Aluminum
    Keisuke Uenishi, Yang Zhai, Tom H.North and Gabor J. Bendszak
    Welding Journal, Vol.79, No.7 (2000) p.184s-193s.
  31. Fabrication of Thick Intermetallic Compound Al3Ti Layer on Ti Substrate by Reactive - Pulsed Electric Current Sintering
    Toshio Matsubara, Tomohide Shibutani, Keisuke Uenishi and Kojiro F. Kobayashi
    Intermetallics, Vol.8 Iss.7 (2000) p815-822.

  32. Ti-Ni形状記憶合金とステンレス綱のろう付
    関政則、山本弘樹、上西啓介、小林紘二郎
    金属学会誌, Vol.64 No.8 (2000), p.632-640.
  33. Fabrication of Thick Intermetallic Compound Al3Ti Layer on Metal Substrate by Combustion Synthesis of Ball-milled Powder
    Toshio Matsubara, Keisuke Uenishi and Kojiro F. Kobayashi
    Material Transactions, JIM, Vol.41 No.5 (2000), p.631-634
  34. Nano-structured Intermetallic Compound TiAl Obtained by Crystallization of Mechanically Alloyed Amorphous TiAl and Its Subsequent Grain Growth
    Makoto Kambara, Keisuke Uenishi and Kojiro F.Kobayashi
    Journal of Materials Science, Vol.35 No.11 (2000), P.2897-2905
  35. BGA接合部組織と機械的特性に及ぼすはんだボール中のCuコアの影響
    清野紳弥、上西啓介、小林紘二郎、荘司郁夫、山本雅春
    エレクトロニクス実装学会誌, Vol.2 No.4 (1999), p298-302
  36. Application of Mechanically Alloyed Ti-Al Powders to the Low Pressure Plasma Spraying
    Keisuke Uenishi, Minoru Murase and Kojiro F.Kobayashi
    Zeitsschrift fur Metallkunde Bd.90 H.4 (1999), p.289-293
  37. Combustion Synthesis of Intermetallic Compound Al3Ti and Its Simultaneous Joining with TiAl
    Keisuke Uenishi, Toshio Matsubara and Kojiro F.Kobayashi
    Zeitsschrift fur Metallkunde Bd.90 H.2 (1999), p.163-167
  38. Formation of Surface Layer Based on Al3Ti on Aluminum by Laser Cladding and Its Compatibilities with Ceramics
    Keisuke Uenishi and Kojiro F.Kobayashi
    Intermetallics, (1999) Vol.7 No.5 (1999) p. 553-559

  39. メカニカルアロイング粉末を用いた燃焼合成法によるCu基材へのAl3Ti厚膜形成
    松原敏夫、森野慎也、上西啓介、小林紘二郎
    材料、Vol.47, No.11 (1998) p.1106-1111
  40. Mechanical alloying in the Al-Bi System
    Keisuke Uenishi, Kim H.Yong and Kojiro F.Kobayashi
    Journal of Materials Science, Vol.31, (1996), p.3605-3611
  41. Processing of Intermetallic Compounds for the Structural Application at High Temperature Environments
    Keisuke Uenishi and Kojiro F.Kobayashi
    Intermetallics, Vol.4 No.1 (1996) p.S95-101

  42. Intermetallic Compound Al3Ti Based Composite Layers formed on Aluminum Substrate
    Keisuke Uenishi and Kojiro F.Kobayashi
    Solidification Science and Processing, (1996) p.231-238
  43. 燃焼合成による球状黒鉛鋳鉄基板へのNi-Al系金属間化合物コーティング層の生成
    池永明, 後藤佳行, 新田康寛, 川本信, 小林紘二郎, 上西啓介
    鋳造工学、Vol.68 No.5 (1996) p.417-422
  44. Joining of Intermetallic Compound TiAl Using Self-Propagating High Temperature Synthesis Reaction
    Keisuke Uenishi, Hiroyuki Sumi and Kojiro F.Kobayashi
    Zeitschrift fur Metallkunde., B86, H.1, (1995) p.64-68.
  45. Joining of Intermetallic Compound TiAl by Using Al Filler Metal
    Keisuke Uenishi, Hiroyuki Sumi and Kojiro F.Kobayashi
    Zeitschrift fur Metallkunde., B.86, H.4, (1995) p.270-274
  46. Enhanced Milling Efficiency for Amorphization by Mechanical Alloying the Mixture of pure Al and Atomized Al-20at%Cr Alloy Powders
    Keisuke Uenishi and Kojiro F.Kobayashi
    Materials Transaction of Japan Institute of Metals, Vol.36, No.7 (1995) p.810-814
  47. Microstructure of Mechanically Alloyed Al-In Alloys
    Keisuke Uenishi, Hidemi Kawaguchi and Kojiro F.Kobayashi
    Journal of Materials Science, Vol.29 (1994) p.4860-4865.
  48. Fabrication of Bulk Amorphous by Rolling of Mechanically Alloyed Al-Cr Powders
    Keisuke Uenishi and Kojiro F.Kobayashi
    Materials Science and Engineering, A181/182, (1994) p.1165-1168.
  49. Al基板上への金属間化合物Al3Tiのレーザクラッディング
    上西啓介、小林紘二郎
    軽金属構造溶接, 31巻 4号, (1993) p.1-5
  50. Mechanical Alloying in the Fe-Cu System
    Keisue Uenishi, Kojiro F.Kobayashi, Saburo Nasu, Hitoshi Hatano, Keiichi N.Ishihara and P.Hideo Shingu
    Zeitschrift fur Metallkunde, Bd.83 H.2, (1992), p.132.
  51. Formation of Titanium Aluminides on Aluminium Surface by CO2 Laser Alloying
    Keisuke Uenishi, Akiyoshi Sugimoto and Kojiro F.Kobayashi
    Zeitschrift Fur Metallkunde, Bd.83 H.4, (1992), p.241.
  52. Formation of (Al,In)-Sb Alloys by Mechanical Alloying
    Keisuke Uenishi, Kojiro F.Kobayashi, Keiichi N.Ishihara and P.Hideo Shingu
    Materials Science Forum, Vol.88-90, (1992), p.453.
  53. Non-equilibrium Phase Formation in Fe-Ag-Cu Sysytem by Mechanical Alloying
    Keisuke Uenishi, Kojiro F.Kobayashi, Keiichi N.Ishihara and P.Hideo Shingu
    Materials Science Forum, Vol.88-90, (1992), p.459
  54. Formation of Super-saturated Solid Solution in Ag-Cu System by Mechanical Alloying
    Keisuke Uenishi, Kojiro F.Kobayashi, Keiichi N.Ishihara and P.Hideo Shingu
    Materials Science and Engineering, Vol.A134, (1991), p.1342.


【Papers submitted】


【Proceedings Paper】

  1. Ag添加したSn-Bi系共晶はんだの組織と強度
    中嶋清吾、鳥居久範、宮田知徳、落合正行、作山誠樹、上西啓介、佐藤武彦
    Proc. 12th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, Yokohama Japan, (2006) p.19-22.
  2. 各種バリア金属材料とSn-Ag系はんだとの接合界面組織
    田中里英子、小山晃弘、藁科卓、上西啓介、佐藤武彦
    Proc. 12th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, Yokohama Japan, (2006) p.145-148.
  3. 低融点はんだを用いた Flip-chip BGAはんだ接合部の信頼性
    赤松俊也、山下潤、落合正行、作山誠樹、上西啓介、佐藤武彦、藤本公三
    Proc. 12th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, Yokohama Japan, (2006) p.259-264
  4. Diode Laser Cladding on A5052 Aluminum Alloy for Wear Resistance
    S. Iwatani, Y. Ogata, K. Uenishi and K. F.Kobayashi
    Proc. ASME Heat Transfer Conference, HT2005-72442

  5. Sn-AgはんだとAu/Ni-Coめっきとのマイクロ接合部急速合金化に関する研究
    小林真司、山本孝志、上西啓介、小林紘二郎、石尾雅昭、塩見和弘、橋本彰夫、山本雅春
    Proc. of the 12th Sympo. on Microelectronics (MES2004), 2004, Osaka Japan, (2004) p.233-266

  6. Pseudo-elastic and Bio-chemical Properties of Ti-Ni Shape Memory Alloy Wires Micro-welded by YAG Laser
    Keisuke Uenishi, Masaya Takatsugu and Kojiro F.Kobayashi
    Proceedings of Fourth International Symposium on Laser Precision Microfabrication, 2003 Munich Germany, SPIE Vol.5063 (2004) p.282-286.

  7. マイクロ接合部高融点化のためのSn-AgはんだとAu/Ni-Coめっきとの反応性評価
    山本孝志、酒谷茂昭、上西啓介、小林紘二郎、石尾雅昭、塩見和弘、橋本彰夫、山本雅春
    Proc. 9th Sympo. on Microjoining and Assembly Technologies for Electronics, 2004, Yokohama Japan, (2004) p.117-122.
  8. YAG Laser Micro Welding of Stainless Steel and Shape Memory Alloys
    Keisuke Uenishi, Masanori Seki, Takeshi Kunimasa, Masaya Takatsugu, Kojiro F.Kobayashi, Takeshi Ikeda and Akihiko Tuboi
    Proceedings of Third International Symposium on Laser Precision Microfabrication, 2002 Osaka Japan, SPIE Vol.4830 (2003) p.57-62

  9. Sn-Agはんだを用いたマイクロ接合部の金属間化合物化に関する研究」
    山本孝志、酒谷茂昭、上西啓介、小林紘二郎、石尾雅昭、塩見和弘、橋本彰夫、山本雅春
    Proc. of the 13th Sympo. on Microelectronics (MES2003), 2003, Osaka Japan, (2003) p.45-48.
  10. Sn-Ag系はんだと無電解Ni-P合金めっきとの界面反応と強度
    上西啓介、小原泰浩、酒谷茂昭、小林紘二郎
    Proc. 8th Sympo. on Microjoining and Assembly Technologies for Electronics, 2003, Yokohama Japan, (2003) p.289-294.

  11. Joint Microstructure of Ni-Al-(Si) Intermetallic Compound and Spheroidal Graphite Cast Iron Formed by Combustion Synthesis
    Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
    Proc of the Inter. Conf. on Designing of Interfacial Structure in Advanced Materials and Their Joints (DIS'02)、Nov.21-22 2002、Osaka, (2002), p.584-589
  12. Interfacial Reaction Between Cu Core Pb Free Solder Balls and the Ni/Au Coated Cu Pads
    Shigeaki Sakatani, Yasuhiro Kohara, Keisuke Uenishi, Kojiro F. Kobayashi and Masaharu Yamamoto
    Proc of the Inter. Conf. on Designing of Interfacial Structure in Advanced Materials and Their Joints (DIS'02)、Nov.21-22 2002、Osaka, (2002), p.734-739
  13. Nd-YAG Lase Micro Welding of Stainless Wire
    Masaya Takatugu, Masanori Seki, Takeshi Kunimasa, Keisuke Uenishi, Kojiro F. Kobayashi, Takeshi Ikeda and Akihiko Tuboi
    Proc of the Inter. Welding and Joining Conf.-Korea 2002, Oct.28-30, Gyeongju Korea, (2002), p.187-192.

  14. Development of Sn Based Multi Component Solder Balls with Cu Core for BGA Package
    Shigeaki Sakatani, Yasuhiro Kohara, Keisuke Uenishi, Kojiro F. Kobayashi and Masaharu Yamamoto
    Proc of the Inter. Welding and Joining Conf.-Korea 2002, Oct.28-30, Gyeongju Korea, (2002), p.450-455

  15. Effect of Added Si on Densification of Ni-Al Intermetallic Coating on Spheroidal Graphite Cast Iron Substrates
    Tetsuro Kimata, Keisuke Uenishi, Akira Ikenaga and Kojiro F. Kobayashi
    Proc of the Inter. Welding and Joining Conf.-Korea 2002, Oct.28-30, Gyeongju Korea, (2002), p.726-731.

  16. BGA用Sn-Ag系はんだとNi-P合金めっきとの界面微細構造観察
    酒谷茂昭、小原泰浩、佐伯敏男、上西啓介、小林紘二郎
    Proc. of the 12th Sympo. on Microelectronics (MES2002), 2002, Osaka Japan, (2002) p.127-130.
  17. Sn-Bi/Sn-AgめっきしたCuコアはんだボールのリフロー特性
    酒谷茂昭、小原泰浩、上西啓介、小林紘二郎、山本雅春,
    Proc. 8th Sympo. on Microjoining and Assembly Technologies for Electronics (MATE2002) 、Jan.31-Feb.1、Yokohama Japan、2002, 147-152
  18. Microstructure and Reliabilty of BGA Joint Using Lead Free Solders
    Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Masataka Nishiura and Kojiro F.Kobayashi
    Proc. Fourth Pacific Rim Int. Conf. on Advanced Materials and Processing (PRICM4), (The Japan Institute of Metals, 2001) p.1063-1066.
  19. Influence of Microstructure on Mechanical Strength of Electroless ni-P Plating and Pb Free Solder Joint
    Masataka Nishiura, Akihiko Nakayama, Shigeaki Sakatani, Yasuhiro Kohara, Toshio Saeki, Keisuke Uenishi and Kojiro F. Kobayashi
    Proceeding of 7th International Conference on Today and Tommorow in Science and Technology of Welding and Joining (7WS)、Nov.20-22　2001、Kobe Japan、Vol.2, p.1305-1310

  20. Formation of Nanostructured Coating Layers of Al3Ti and Its Composites by Rapidly Consolidation of Mechanically Alloyed Powders
    Toshio Matsubara, Tomohide Shibutani, Keisuke Uenishi and Kojiro F.Kobayashi,
    Proc. International Conference on Trends in Mechanical Alloying : Science, Technology & Applications (TMA-2001), Jaipur, India, February 21-23, (2001)
  21. Sn/Ag多層めっきCuコアはんだボールとAu/NiめっきパッドとのBGA接合性評価
    酒谷茂昭、佐伯敏男、小原泰浩、上西啓介、小林紘二郎、山本雅春
    Proceedings of 11th Microelectronics Symposium (MES2001)、Oct.18-19、Osaka Japan、p.35-38.
  22. はんだ中のCuがBGA接合部界面反応に及ぼす影響
    上西啓介、小原泰浩、酒谷茂昭、小林紘二郎
    Proceedings of 11th Microelectronics Symposium (MES2001)、Oct.18-19、Osaka Japan、p.71-74.
  23. BGAパッケージへのSn,Ag多層めっきを施したCuコアPbフリーはんだボールの適用
    小原泰浩、佐伯敏男、上西啓介、小林紘二郎、山本雅春
    Proc. 7th Sympo. on Microjoining and Assembly Technologies for Electronics, 2001, Yokohama Japan, (2001) p.119-124
  24. Sn-Agはんだを用いたBGA接合部組織に及ぼすCuコアの影響
    佐伯敏男、上西啓介、小林紘二郎、荘司郁夫、山本雅春
    Proc. 6th Sympo. on Microjoining and Assembly Technologies for Electronics, 2000, Yokohama Japan, (2000) p.255-260
  25. Cuコアはんだボールを用いたBGA接合部組織と機械的特性ー第２報ー
    清野紳弥、佐伯敏男、上西啓介、小林紘二郎、荘司郁夫、山本雅春
    Proc. 6th Sympo. on Microjoining and Assembly Technologies for Electronics, 2000, Yokohama Japan, (2000) p.125-130
  26. Cuコアはんだボールを用いたBGA接合部組織と機械的特性
    清野紳弥、上西啓介、小林紘二郎、荘司郁夫、山本雅春
    Proc. 5th Sympo. on Microjoining and Assembly Technologies for Electronics, 1999, Yokohama Japan, (1999) p.115-120
  27. Improvement in Wear Properties of Al by Laser Claddiong of Al3Ti/ceramics Composite Layers
    Keisuke Uenishi and Kojiro F.Kobayashi
    Proc. 4th Int. Conf. on Aluminum Alloys, 1994, Atlanta USA, vol.2 (1994) p.714-720.
  28. Bonding of YBa2Cu3O7-X High Temperature Superconductive Tape on Metal Substrate with Sprayed PSZ Buffer Layer
    Kenichi Matsui, Ryozo Katsutani, Minoru Tagami, Yasumasa Nakanishi, Keisuke Uenishi and Kojiro F.Kobayashi
    Proc. Int. Sympo. on Superconductivity 93', 1993, Hiroshima Japan, (1994) p.839-842.
  29. Application of CIP Treatment of YBa2Cu3O7-X Superconductive Thick Film on Metal Substrate with PSZ Buffer Layer
    Kenichi Matsui, Ryozo Katsutani, Minoru Tagami, Yasumasa Nakanishi, Keisuke Uenishi and Kojiro F.Kobayshi
    Proc. Int. Sympo. on Superconductivity '92, 1992, Kobe Japan, (1993) P.653-656.
  30. Mechanical Alloying of Aluminum Alloys
    Kojiro F.Kobayshi and Keisuke Uenishi
    Proc. 1st Int. Conf. on Proc. Materials for Properties, 1993, Honolulu USA, (1993)p.683.
  31. Laser Cladding of Al3Ti-Ceramics Composite Layer for Al Surface Modification
    Keisuke Uenishi and Kojiro F.Kobayshi
    Proc. of 3rd Japan SAMPE Symposium, 1993, Makuhari Japan, vol.1, (1993) p.1038-1042..
  32. Formation of Titanium-Trialuminide Layer on Aluminum Surface by CO2 Laser Processing
    Keisuke Uenishi, Tomihiro Murakami, Akiyoshi Sugimoto and Kojiro F.Kobayashi
    Proc. Int. Conf. on LAMP, 1992, Nagaoka Japan,Vol.1, (1992), p.807-812.
  33. Metastable Alloy Phase Formation by Repeated Rolling in Some CommonMetallic Binary Alloy Systems
    P.Hideo Shingu, Keiichi N.Ishihara, Keisuke Uenishi, Junji Kuyama, Bing Huang and Saburo Nasu
    Solid State Powder Processing, (1990) p.21-34.
  34. Formation and Consolidation of Mechanically Alloyed Cu-Ti Amorphous Powders
    P.Hideo Shingu and Keisuke Uenishi
    Proc. Sintering '87, 1987, Tokyo Japan, (1988) p.206-211.
  35. Formation of Al-In-Sb Alloys by Solid State Reaction
    P.Hideo Shingu and Keisuke Uenishi
    Proc. Sixth Record of Alloy Semiconductor Physics and Electronics Symposium, 1987, Kyoto Japan, (1988) p.19-25.


【解説・記事】

  1. 次世代電子ＳＩ会 第四回シンポジウム（若手ポスターセッション）報告
    上西啓介
    電子材料 Vol.2 (2006) p.
  2. Jisso技術立国への道　〜若手のネットワーク作り〜
    上西啓介
    電子材料 Vol.8 (2005) p.
  3. 鋼のろう付け
    上西啓介、小林紘二郎
    溶接技術　Vol.6 (2004) in press

  4. 先進材料のプロセシングと製造に関する国際会議（THERMEC'2003）
    上西啓介
    溶接学会誌、Vol.73 No.1 (2004) p.54-55
  5. LAMP2002報告
    上西啓介他
    レーザ加工学会誌、Vol.10 No.1 (2003) p.56-75
  6. 日本における溶接の展望（1999年）
    〜圧接および固相接合（拡散接合、熱間圧接・冷間圧接、その他）
    上西啓介
    溶接学会誌、69巻　5号 (2000) p.28-31
  7. 日本における溶接の展望（1998年）
    〜圧接および固相接合（拡散接合、熱間圧接・冷間圧接、摩擦圧接、その他）
    上西啓介
    溶接学会誌、68巻　5号 (1999) p.25-28
  8. トロント大学留学記
    上西啓介
    溶接学会誌、66巻 8号 (1997) p.65
　

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